Glenn Blackwell

Basic Soldering For Electronics Pace Handbook Of North American
Basic Soldering For Electronics Pace Handbook Of North America
Basic Soldering For Electronics Pace Handbook Of North Carolina

Purdue University

Electrical & Computer Engineering Technology Dept.

Solder is a metal or metallic alloy used, when melted, to join metallic surfaces together. The most common alloy is some combination of tin and lead. Certain tin-lead alloys have a lower melting point than the parent metals by themselves. The most common alloys used for electronics. Free delivery on millions of items with Prime. Low prices across earth's biggest selection of books, music, DVDs, electronics, computers, software, apparel & accessories, shoes, jewelry, tools & hardware, housewares, furniture, sporting goods, beauty & personal care, groceries & just about anything else.

UTEC SMT Course 2014 Web Page

Solder is a metal or metallic alloy used, when melted, to join metallic surfaces together. The most common alloy is some combination of tin and lead. Certain tin-lead alloys have a lower melting point than the parent metals by themselves. The most common alloys used for electronics work are 60/40 and 63/37.
Hand-Solder Training Critical in SMT Assembly, Rework and Repair Our thanks to PACE for allowing us to reprint the following. By: Christopher S. Barrett, Director of Training, PACE Incorporated The evolution of the electronics printed circuit board continues to surprise, amaze and befuddle even the most experienced industry professionals.

The Universidad De Ingenieria & Technologia (UTEC) in Lima, Peru, is a new engineering university in South America. Their web site is www.utec.edu.pe.Electronics is an important part of their curriculum, so together we have developed a short course on Surface Mount Technology (SMT) to introduce their students to three aspects of the use of SMT:

vBasics of SMT components and assembly processes

vPCB design using SMT components, including high-current and high-speed circuits

vBasic hand assembly, assisted hand assembly, and rework/repair of SMT-based assemblies. Tekken 3 memory card save file to computer.

The text for the course is Blackwell & Hollomon, Surface-Mount Technology for PC Boards, 2^nd edition, Thompson/Delmar Learning, 2006.

Here is the errata sheet for the text: B&H Errata

The reason for the course is the continuing increase in the impact of electronics in many areas of technology. An example of electronics’ impact on the automotive industry is here: Automotive Electronics

Here is a basic introduction to surface mount technology, courtesy of Radio-Electronics magazine: R-E SMT Introduction

Cross-section of an example PC board, which shows how SMT components allow easier routing, and in many cases fewer layers, than through-hole technology (THT) components.

THT component leads require that every layer be clear of the hole, while SMT components only affect routing on the surface layer to which they will be soldered.

The course will consist of morning and afternoon lectures, and morning and afternoon laboratories.

```

`SMT decoupling caps on the bottom of a BGA board.

References for the course, in addition to the textbook, include:

vIntel Packaging Handbook: http://www.intel.com/design/packtech/packbook.htm, chapter 1 “Component Surface Mount Technology”, and chapter 2 “SMT Board Assembly Recommendations”.

vTexas Instruments basic SMT component handling, process recommendations, and basic repair/rework recommendations: TI AN-2029

vSilicon Laboratories Application Note on hand soldering QFP packages: Hand Soldering Tutorial for Fine Pitch QFP Devices

vConceptronic Reflow Technology Handbook: Conceptronic RT Handbook

`

LLP/QFN, one of the newer SMT packages discussed in the course.

The course reference for LLP/QFN packages is TI Application Note AN-1187, “Leadless Leadframe Package”: TI AN1187 LLP

And for QFN PCB design, TI “QFN Design Guide”: TI SLMA006 QFN

For any small SMT package, thermal transfer of heat to the board is important. This issue is discussed in TI AN-1520, “A Guide to Board Layout for Best Thermal Resistance for Exposed Packages”:TI AN-1520

Course References:

Thermal Issues, IC:

Texas Instruments “Understanding IC Package Power Capabilities”, http://www.ti.com/lit/an/snva509a/snva509a.pdf

Thermal Issues, PCB:

Ultracad Designs: http://www.ultracad.com/article_outline.htm

Saturn PCB Toolkit: http://www.saturnpcb.com/pcb_toolkit.htm

Blackwell & Hollomon,chapter 5 section 5.8

Texas Instruments application note AN-1520: http://www.ti.com/lit/an/snva183b/snva183b.pdf

High-Speed, By-pass Capacitors:

Ultracad Designs: http://www.ultracad.com/article_outline.htm

Blackwell & Hollomon, chapter 5, section 5-10

Xilinx Vertex-6 PCB Design Guide: http://www.xilinx.com/support/documentation/user_guides/ug203.pdf

Wizards in high-speed design:

Doug Brooks: http://www.ultracad.com

Eric Bogatin: http://bethesignal.com/bogatin

Howard Johnson: http://www.sigcon.com

Lee Ritchey: http://speedingedge.com

General SMT References

General SMT Information:

Basic soldering for electronics pace handbook of north texas

SMT Net: www.smtnet.com
SMT Magazine: www.smtmagazine.com
Surface MountTechnology Assn.: www.smta.org
Intel Packaging Databook chapter 1, “Component Surface Mount Technology” and chapter 2, “SMT Board Assembly Recommendations”, available at www.intel.com/design/packtech/packbook.htm
Circuit Technology’s newsletter and white papers: www.circuitnet.com
High-speed and bypass capacitor information from UltraCAD Design, Inc., available at www.ultracad.com .

Solder paste information:

Amtech Solder: www.amtechsolder.com
Kester Solder: www.kester.com

Hand soldering and rework & repair:

Metcal Corp: www.metcal.com
Pace Corp.:www.paceworldwide.com

Circuit board design:

PCB Design & Fabrication magazine: www.pcdandf.com
PCB Standards for design, manufacturing, and testing, the IPC: www.ipc.org

Lead Free Solder and related Tin Whisker problems:

·IPC Leadfree Site

·NASA Tin Whisker Basics

·Intel Packaging Databook chapter 2, “Component Surface Mount Technology”, available at www.intel.com/design/packtech/packbook.htm

Basic Soldering For Electronics Pace Handbook Of North American

Basic soldering for electronics pace handbook of north carolina

This page last updated 08 August, 2014